Production

Different processes are required according to the structure of the products. The processes that are used in our current products are Laser, SMT, THT, Manual Mounting, Coating, X-Ray, ICT/FCT, Milling Cutter and Final check Processes.

1.LASER PROCESS

In this process, 2D-codes are printed on the cards (PCB, PCBA) by using laser and with burning method. The traceability of the product is achieved with this barcode. Also in the other processes, this code is taken as reference and the traceability of the product is made according to the card. The cards for which 2D-codes are generated with laser are automatically loaded to the magazines (carriers) at the output of the machine with the current machine system.

2.SMT PROCESS (SURFACE MOUNTING TECHNOLOGY)

SMT Process is a process that accommodates five important processes. These processes are Printer(Solder Printing Machine),SPI (Solder Paste Inspection) Pick and Place (String), Reflow (Oven) and AOI (Optic control) processes.

2.1. PCB Cleaner

The surface cleaning process of the PCBs is performed here.

2.2. Printer (Solder Printing Machine)

The soldering work is performed here. Under the humidity and temperature controls, the soldering is made with an appropriate sieve on the soldering blocks located on the card.

2.3. SPI (Solder Paste Inspection)

The test for the height, area, volume, short-circuit and skewness of the solder applied on the block on the card is performed.

2.4. Pick and Place

The placement of the SMT materials on the card is performed in this machine. The faulty material setting is prevented with a verification system. The materials are fed to the machine in a rapid and automated manner.

2.5. Press Fit/PininPaste

The press fit or through hole mounting materials are set on the cream solder during the SMT process.

2.6. Reflow

It is the activation and integration of the solder with the solder block and material on the card at appropriate temperature and times. So the materials are soldered to the card. The process is conducted under nitrous atmosphere.

2.7. AOI

Performs 3D automated optic control. The setting or mounting completed cards are visually inspected in this process. Controls the presence, direction, skewness, height and soldering status of the materials and reports the errors, if any.

3.THT PROCESS (THROUGH HOLE MOUNTING TECHNOLOGY)

Means the through hole mounting technology and the setting and soldering of the legged materials are performed in this process. We can divide this process into four as Radial, Axial, Selective Soldering and Pin Inserter.

3.1. Radial

The radial type (in other words, where the legs are parallel to each other and to the body, and also there are leg connections under the material) materials are set in this process. These materials stay vertically on the card.

3.2. Axial

Axial type (in other words, with cylinder and extended box form and having leg from each tips) materials are set in this process. These materials stay horizontally on the card.

3.3. Pin Inserter

The setting of the materials such as pin, terminal, etc. are performed here. As a result of the setting, the pin locks itself into the hole and then do not require any soldering. Upon request, soldering may be performed following this process.

3.4. Manuel Mounting

Manual process is applied for the materials that cannot be automatically mounted by the machines. Upon request, soldering may be performed following this process.

3.5.Selective Soldering

The materials for which through hole mounting set has been completed and which are received from the manual mounting line are soldered in this process. The soldering process is more reliable and risk-free since the soldering is performed only at the required points.

4. DISPENSER

It is used for applying protective, adhesive, coater, etc. materials at the points on the card according to the request of the customer.

6. X-RAY

3D controls of the required materials and areas of the cards are performed under X-Ray.

5.CONFORMAL COATING

The local protective coating process is performed according to the request of the customer in order to improve the resistance of the cards against the environmental factors.

7. ICT/FCT

The electrical and functional tests of the cards are performed in this process. The values, polarity, presence, currents, voltages and functions of the materials are controlled in this process. The LED Tests are applied under functional tests and the colour, brightness and homogeneity checks are made.

8. MILLING CUTTER(ROUTING)

It is used to separate the panelled PCBs from each other. This method is safe since no pressure is generated on the card.

9. FINAL CHECK

The visual check is performed in this process. The scratched, cut, deformed card or materials that may occur on the lines or may be omitted are detected by means of this process.

10. PACKAGING

The PCBs are set according to the request of the customer and packed per the instructions of the customer.